cystech electronics corp. spec. no. : c771ld issued date : 2009.08.03 revised date : 2013.09.30 page no. : 1/6 SB3150 and sb3200 cystek product specification 3.0amp schottky barrier rectifiers reverse voltage 150v and 200v forward current 3a SB3150 and sb3200 features outline ? low forward voltage drop do-201ad ? high current capability ? high reliability ? high surge current capability ? epitaxial construction mechanical data ? case : jedec do-201ad molded plastic body ? epoxy : ul94v-0 rate flame retardant ? terminals: plated axial leads, solderable per mil-std-202, method 208 guaranteed ? polarity: color band denotes cathode end. ? mounting position : any. ? weight: 1.10 grams ordering information device package shipping SB3150- 0-tc-g sb3200- 0-tc-g do-201ad (pb-free lead plating an d halogen-free package) 1200 pcs / tape & box environment friendly grade : s for rohs compliant products, g for rohs compliant and green compound products packing spec, tc : 1200 pcs / tape & box product rank, zero for no rank products product name
cystech electronics corp. spec. no. : c771ld issued date : 2009.08.03 revised date : 2013.09.30 page no. : 2/6 SB3150 and sb3200 cystek product specification maximum ratings and electrical characteristics ( rating at 25 c ambient temperature unless otherwise specified. single phase, half wave, 60hz, re sistive or inductive load. for capacitive load, derate current by 20%) type parameter symbol SB3150 sb3200 units maximum repetitive peak reverse voltage v rrm 150 200 v maximum rms voltage v rms 105 140 v maximum dc blocking voltage v dc 150 200 v maximum instantaneous forward voltage at 3a 1 v f 0.89 v maximum average forward rectified current i f(av) 3 a peak forward surge current @8.3ms single half sine wave superimposed on rate d load (jedec method) i fsm 80 a t a =25c 0.5 maximum dc reverse current at rated dc blocking voltage 1 t a =100c i r 10 ma typical junction capacitance c j 250 pf typical thermal resistance r ja 20 /w operating junction temperature range t j -55 ~ +150 storage temperature range t stg -55 ~ +150 note: 1.pulse test: pulse width 300 s, duty cycle 2%
cystech electronics corp. spec. no. : c771ld issued date : 2009.08.03 revised date : 2013.09.30 page no. : 3/6 SB3150 and sb3200 cystek product specification characteristic curves forward current derating curve 0 0.5 1 1.5 2 2.5 3 3.5 0 20 40 60 80 100 120 140 160 ambient temperature---t a () average forward current---i f(av) (a) forward current vs forward voltage 0.01 0.1 1 10 100 0.10.30.50.70.91.11.31.5 forward voltage---v f (v) instantaneous forward current---i f (a) tj=25, pulse width=300s, 1% dut y c y cle maximum non-repetitive forward surge current 0 20 40 60 80 100 1 10 100 number of cycles at 60hz peak forward surge current---i fsm (a) tj=25, 8.3ms single half sine wave jedec method reverse leakage current vs reverse voltage 0.01 0.1 1 10 100 0 20 40 60 80 100 120 140 percent of rated peak reverse voltage---(%) reverse leakage current---i r (ma) tj=75 tj=25 junction capacitance vs reverse voltage 0 100 200 300 400 500 600 700 0.01 0.1 1 10 100 reverse voltage---v r (v) junction capacitance---c j (pf)
cystech electronics corp. spec. no. : c771ld issued date : 2009.08.03 revised date : 2013.09.30 page no. : 4/6 SB3150 and sb3200 cystek product specification taping dimension
cystech electronics corp. spec. no. : c771ld issued date : 2009.08.03 revised date : 2013.09.30 page no. : 5/6 SB3150 and sb3200 cystek product specification recommended wave soldering condition product peak temperature soldering time pb-free devices 260 +0/-5 c 5 +1/-1 seconds recommended temperature profile for ir reflow profile feature sn-pb eutectic assembly pb-free assembly average ramp-up rate (tsmax to tp) 3 c/second max. 3 c/second max. preheat ? temperature min(t s min) ? temperature max(t s max) ? time(ts min to ts max ) 100 c 150 c 60-120 seconds 150 c 200 c 60-180 seconds time maintained above: ? temperature (t l ) ? time (t l ) 183 c 60-150 seconds 217 c 60-150 seconds peak temperature(t p ) 240 +0/-5 c 260 +0/-5 c time within 5 c of actual peak temperature(tp) 10-30 seconds 20-40 seconds ramp down rate 6 c/second max. 6 c/second max. time 25 c to peak temperature 6 minutes max. 8 minutes max. note : all temperatures refer to topside of t he package, measured on the package body surface.
cystech electronics corp. spec. no. : c771ld issued date : 2009.08.03 revised date : 2013.09.30 page no. : 6/6 SB3150 and sb3200 cystek product specification do-201ad dimension do-201ad molded plastic package cystek package code: ld inches millimeters inches millimeters dim min. max. min. max. dim min. max. min. max. a ? 0.048 ? 0.052 ? 1.20 ? 1.30 d 1.000 - 25.40 - b 1.000 - 25.40 - e ? 0.190 ? 0.210 ? 4.80 ? 5.30 c 0.285 0.375 7.20 9.50 notes : 1.controlling dimension : millimeters. 2.maximum lead thickness includes lead finish thickness, and minimum lead thickness is the minimum thickness of base material. 3.if there is any question with packing specification or packing method, please c ontact your local cystek sales office. material : ? lead : axial leads, solderable per mil-std-202, method 208 guaranteed. ? mold compound : epoxy resin family, flammability solid burning class: ul94v-0 important notice: ? all rights are reserved. reproduction in whole or in part is prohibited without the prior written approval of cystek. ? cystek reserves the right to make changes to its products without notice. ? cystek semiconductor products are not warranted to be suitable for use in life-support applications, or systems. ? cystek assumes no liability for any consequence of customer pr oduct design, infringement of pat ents, or application assistance .
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